Cornell University researchers have used high-resolution 3D imaging to detect atomic-scale defects in ICs. The imaging method was the result of a collaboration with TSMC and ASM and the research was ...
A technical paper titled “SEMI-PointRend: Improved Semiconductor Wafer Defect Classification and Segmentation as Rendering” was published (preprint) by researchers at imec, University of Ulsan, and KU ...
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