A new technical paper, “Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of ...

A new technical paper, “Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling ...

New in-vehicle networking technology will likely take over as more AI is added, but in the near term designers face ...

Interface IP in 3D; SOCAMM in data centers; edge intelligence implementations; deposition, etch for 3D; interconnect ...

A Fault-Tolerant Compiler for Chiplet Quantum Architectures,” was published by researchers at the Technical University of ...

TSMC announced three new advanced process technologies at its North America Technology Symposium last week A13, A12 and N2U ...

At the end of the day, because of the techniques we utilized, we can apply these post-quantum cryptography primitives while ...

SoIC ESD Protection for Chiplet-Based 3D Microsystems: Future Research Directions,” was published by researchers at the ...

A new technical paper, “Characterisation of Complex Multilayer Nanostructures with High Aspect Ratio,” was recent published ...

A new technical paper, “Agentic AI-based Coverage Closure for Formal Verification,” was published by researchers at Infineon ...

A new technical paper, “Epoxy Composites Reinforced with Long Al2O3 Nanowires for Enhanced Thermal Management in Advanced ...

It’s generally assumed advanced materials will behave the same in the lab as in production, but that assumption is now under ...