SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

The packaging sector in 2025 is undergoing significant change, driven by a convergence of environmental concerns, technological advances and shifting consumer expectations.

In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the ...

Produce, use, reuse – by 2025, we want to design and develop 100 percent of Henkel's packaging so that it can be reused or recycled as completely as possible. 1 This is because we want to continuously ...