Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause ...

The semiconductor industry’s push into 3D integration and large-format substrates has fundamentally changed the role of materials in packaging. What were once structural supports and electrical ...

Over the last decade, there has been a surge in research concentrating on 2D materials other than graphene. Furthermore, by stacking different 2D materials, the attributes of 2D materials can be ...