The supplier of high-bandwidth-memory products to Nvidia plans to build the chip packaging plant in Cheongju, south of Seoul ...
SK Hynix Inc. is preparing a major capacity push as the global race to build AI-ready data centres strains the memory supply chain. The South Korean chipmaker plans to invest 19 trillion won ($12.9 ...
SK Hynix recently announced a major investment in a new South Korean plant. The Icheon-based company will spend $12.9 billion to develop a facility dedicated to advanced ...
SK Hynix, Samsung, TSMC, and Micron are investing billions to meet demand for high-bandwidth memory and advanced chips for the AI boom.
SK Hynix has announced this week it will invest 19 trillion won (or $12.90 billion) into a new advanced chip packaging ...
SK Hynix Inc, a key supplier to Nvidia and one of the worlds largest memory chipmakers, announced plans to invest 19 trillion ...
Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore. The new HBM advanced packaging facility will be the first ...
The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...
Micron Technology, Inc. has commenced the construction of a High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, the first of its kind in the country. The groundbreaking ceremony ...
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