NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, ...
The semiconductor industry is changing rapidly, with one of the biggest developments being the move from traditional pogo-based die probing to photonic beam probing for Very-Large-Scale Integration ...
It took scientists just 0.9 megapascals of pressure to pierce a problem holding back the next wave of display technology. At Tianjin University, researchers have unveiled a groundbreaking method to ...
Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...
TOKYO, Dec. 07, 2023 (GLOBE NEWSWIRE) -- Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced three new additions to its suite of memory test products. The ...
Ardentec's Longtan plant is set to begin taking AI ASIC wafer-probing orders in the third quarter of 2026, as the ...
Parallel piezo aligners with fly height sensors enable faster PIC wafer testing. Parallel miniaturized piezoelectric alignment engines with fly-height sensors enable faster PIC wafer testing. Image ...
The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...
Based on FormFactor's scalable MicroSpring interconnect technology, the PH150 probe card enables the testing of 300-mm DRAM wafers in just six touchdowns. The ability to test a wafer in fewer ...
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