The market for portable and mobile data access devices that are wirelessly connected to the cloud anytime and anywhere is exploding. The trend to access any network from anywhere is driving increased ...

SEOUL, South Korea, July 15, 2025 /PRNewswire/ -- SK keyfoundry, an 8-inch pure-play foundry in Korea, announced today that it has successfully co-developed core technology and completed reliability ...

With the rise of smart devices, applications for semiconductor components are quickly expanding. The requirements for chip size, information transmission speed, and power in network communications, ...

SK keyfoundry, an 8-inch pure-play foundry in Korea, has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor ...

The rapid growth of large language models is placing increasing demands on data centers, where large volumes of data must be ...

A look at design considerations for a double-sided RDL, including board-level reliability and the challenges of higher density. System-in-Package (SiP) technology continues to be essential for higher ...

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of its Integrated ...

Moore’s Law in process technology is on its last legs, so advanced packaging is taking up the baton. Advanced techniques such as fan-out wafer-level packaging (FOWLP) allow increased component density ...

TSMC certifies CoWoS® and InFO design flows based on the Synopsys 3DIC Compiler unified platform 3DIC Compiler accelerates advanced packaging design productivity Integrated with Ansys' chip-package co ...

Where does advanced packaging stand in 2017? Is it nearing an inflection point? The semiconductor industry is steadily running out of transistor scaling options, so the spotlight is inevitably turning ...

SK keyfoundry, an 8-inch pure-play foundry in Korea, has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor ...