Yahoo Finance

Redistribution Layer Material Market Forecast to 2028 - COVID-19 Impact and Global Analysis By Material Type [Polyimide, Polybenzoxazole, Benzocylobutene, and Others] and ...

New York, Jan. 06, 2022 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Redistribution Layer Material Market Forecast to 2028 - COVID-19 Impact and Global Analysis By ...
Yahoo Finance

The Global Wafer Level Packaging Market size is expected to reach $14.1 billion by 2028, rising at a market growth of 17.7% CAGR during the forecast period

New York, June 28, 2022 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global Wafer Level Packaging Market Size, Share & Industry Trends Analysis Report By End User, By Type ...
Yahoo Finance

Global Wafer Level Packaging Market Report 2022 to 2028: Players Include ASML Holdings, Fujitsu, Toshiba, Qualcomm and Amkor Technology

Dublin, Nov. 22, 2022 (GLOBE NEWSWIRE) -- The "Global Wafer Level Packaging Market Size, Share & Industry Trends Analysis Report By End User, By Type, By Regional Outlook and Forecast, 2022 - 2028" ...
Digi Times

Interview with AZZURRO Semiconductors CEO Erwin Wolf: Mass production of 200mm GaN-on-Si wafer will drive significant shift of LED market

With excellent cost advantages, GaN-on-Si technology has become a new focus in the LED market in order to cope with the severe price pressure for LED makers. In recent years, this technology has made ...
EDN

Samsung introduces LED components based on chip-scale packaging technology

Samsung Electronics introduced a full line-up of chip-scale LED packages (CSP), including 0.6-W-class and 3-W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages. Samsung’s CSP technology ...