A new process combines two well-known bonding methods, edge folding and ultrasonic welding, to create an optimized procedure for joining decorative materials like vinyl, textiles, or leather to a ...
As a package substrate, the benefits of glass are substantial. It’s extremely flat with lower thermal expansion than organic substrates, which simplifies lithography. And that’s just for starters.
Dublin, Oct. 07, 2025 (GLOBE NEWSWIRE) -- The "The Global Market for Glass Substrates for Semiconductors 2026-2036" report has been added to ResearchAndMarkets.com's offering. The Global Glass ...
NEC Corp. and NEC Electronics Ltd. Wednesday introduced a Multi-layer Thin Substrate (MLTS) and corresponding chip-scale package that the company said is smaller than CSP types now used. NEC said it ...
With the advancement of artificial intelligence (AI) semiconductors, various issues have arisen in packaging, leading to growing interest in glass substrates, which offer significant technological ...
TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
Sawnics announced a process design kit (PDK) based on Soitec’s Connect piezo-on-insulator (POI) substrates to accelerate RF filter design for 5G smartphones. The South Korean foundry, with expertise ...
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