In 1999, Stig Oresjo, then of Agilent Technologies, conducted a major study of solder-joint defects on printed-circuit boards (PCBs). The study, which at the time provided the most definitive data on ...
Eunil H.A. Americas has added the PARMI SPI HS30 in-line solder paste inspection system to its product line. The SPI HS30 uses a 3D laser triangulation sensor and intelligent vision algorithm to ...
Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This ...
We might be amidst a chip shortage, but if you enjoy reverse-engineering, there’s never a shortage of intriguing old chips to dig into – and the 2513N 5×7 character ROM is one such chip. Amidst a long ...
The printed circuit board assembly process has undergone revolutionary changes over the past three decades. What once relied ...
X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...
High-bandwidth memory stands at the forefront of multiple technology developments as a critical enabler of AI, but it is one of the most difficult modules to manufacture. Leading HBM device makers and ...
New solar manufacturing facilities show higher rates of product defects, PV Tech has heard from Joerg Althaus of Clean Energy Associates. PV Tech spoke with Joerg Althaus of CEA about the ...
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