Science Daily

Peel-and-stick solar panels: Decal-like application process allows thin, flexible solar panels to be applied to virtually any surface

The new process involves a unique silicon, silicon dioxide and metal "sandwich." First, a 300-nanometer film of nickel (Ni) is deposited on a silicon/silicon dioxide (Si/SiO2) wafer. Thin-film solar ...
Yahoo Finance

[Latest] Global Silicon Wafer Market Size/Share Worth USD 34 Billion by 2033 at a 6.3% CAGR: Custom Market Insights (Analysis, Outlook, Leaders, Report, Trends, Forecast ...

Austin, TX, USA, Jan. 24, 2025 (GLOBE NEWSWIRE) -- Custom Market Insights has published a new research report titled “Silicon Wafer Market Size, Trends and Insights By Wafer Size (Less than 150 mm, ...
Semiconductor Engineering

New Spintronics Manufacturing Process, Allowing Scaling Down To Sub-5nm (U. of Minnesota/NIST)

A new technical paper titled “Sputtered L1 0-FePd and its Synthetic Antiferromagnet on Si/SiO2 Wafers for Scalable Spintronics” was published by researchers at University of Minnesota and NIST, with ...
Electronic Design

Ultra-Thin Silicon Wafers Wring More from Power Electronics

Modern chips are manufactured on slabs of silicon less than a millimeter thick. But semiconductor companies try to slice these silicon wafers thinner and thinner to squeeze more performance out of ...