TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking. TSMC said SoIC-P complements its existing ...
High-reliability packages, always in demand within the automotive, medical, and RF fields, are now going green. A fully qualified flip-chip small-outline IC (FC-SOIC) narrow body package developed by ...
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