Copper (Cu) foil, with its exceptional electrical and thermal conductivity, serves as a foundational material for integrated circuits, high-frequency communication, and advanced energy technologies.
The major factors affecting the performance of crystalline thin films are the presence of grain boundaries and inherent crystal structure. Post-deposition annealing is frequently employed to improve ...
A recent article published in the Journal of Materials Research and Technology proposed a grain size control method to improve the durability of Al-Cu-Mg-Ag alloy at high temperatures. A relationship ...
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