Data is an integral part of our lives. Contrary to the past, where files had to be removed periodically to free up storage space, we now assume that our data will never be deleted. Why risk deleting ...
Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...
Micron has now entered the HBM3 race by introducing a “second-generation” HBM3 DRAM memory stack, fabricated with the company’s 1β semiconductor memory process technology, which the company announced ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
If the HPC and AI markets need anything right now, it is not more compute but rather more memory capacity at a very high bandwidth. We have plenty of compute in current GPU and FPGA accelerators, but ...
Microsoft announced today a new security feature for the Windows operating system. Named "Hardware-enforced Stack Protection," this feature allows applications to use the local CPU hardware to protect ...
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