(Nanowerk News) Imec presents a via-middle through-Si-via (TSV) approach to 3D stacking. This method is new to industry as it allows to 'reveal' TSV contacts by using a Si-etch process. The process ...

Researchers have proposed process flow guides for 3D printing of miniature soft pneumatic actuators. Integrating the prints into a robotic system offers potential applications in jet-engine ...

The semiconductor industry has always faced challenges caused by device scaling, architecture evolution, and process complexity and integration. These challenges are coupled with a need to provide new ...

We list the best flowchart software, to make it simple and easy to design, organize and implement workflow strategies and manage multiple projects. While flowchart software may not sound like a ...

This week Flow Science released a new version of FLOW-3D Cast, its software specially-designed for metal casters. FLOW-3D Cast v4.1 offers powerful advances in modeling capabilities, accuracy and ...

Thanks to a rotating platform, a new 3D metal printer can deposit and fuse metal powder in a single step, thereby working faster than conventional machines. The system can process two different metals ...

SUTD, SUSTech and ZJU researchers' proposed process flow guides 3D printing of miniature soft pneumatic actuators. Integrating the prints into a robotic system offers potential applications in ...