Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...
PCB-based packaging for GaN power devices and modules is the subject of a UK government-funded consortium that will develop both technology and an all-UK GaN module supply-chain. The project, ...
As a designer of High Frequency Radio equipment for over 40 years, I found difficulties in sufficiently isolating one stage of a radio system from another, this can cause interference between adjacent ...
Antennas are sensitive to their surroundings. Thus, when there’s an antenna on the PCB, the layout for the design should take the requirements of the antenna into account, as this can make a huge ...
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