AZOM

Types of Semiconductor Packaging and Their Properties

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
EDN

New Solution Combines Cypress's HyperFlash™ and HyperRAM™ Memories Based on the High-Bandwidth, Low-Pin-Count HyperBus™ Interface

The HyperFlash and HyperRAM MCP leverages Cypress's 12-pin HyperBus™ interface and is housed in a 24-ball ball grid array (BGA) package that shares a common footprint with both discrete HyperFlash and ...
Hackaday

Working With BGAs: Design And Layout

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...
PC Magazine

Socket 370

The motherboard receptacle for Pentium II and III CPUs. Socket 370 accepts a 370-pin PPGA (plastic pin grid array) chip package. Socket 370 chips and motherboards cost less to manufacture than the ...
EDN

LSI unveils I/O-rich flip-chip package

SAN MATEO, Calif. — LSI Logic Corp. has developed a library of standard ball-grid array flip-chip packages using organic materials that are said to let designers place I/Os anywhere on the die, ...