Apple's persistent quest for better performance, longer battery life, and slimmer form factors appears to be driving its research into advanced chip packaging technologies. So-called "2.5D" and "3D" ...

36th Annual State of Logistics Report: Navigating uncertainty amid rising costs and global disruptions The 36th Annual State of Logistics (SoL) Report highlights a logistics market tested by economic ...

The dizzying pace of semiconductor IC miniaturization and performance advances keeps changing the face of IC packaging. Demands for lower-cost packaging that must also deal with greater amounts of ...

Dr. Navid Asadi’s group examines chip packaging methods such as system-in-package (SIP). This is the second of a mutlipart series on chip packaging technologies. Peter (Chengjie) Xi is currently a ...

Automotive radar systems are typically composed of an antenna, front-end radar sensor and back-end signal processor. Current state-of-the-art automotive radar systems make use of the latest integrated ...