The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are ...
Packaging testing services help manufacturers validate packaging designs to withstand vibration, compression, drop impact, and environmental stress. This has become especially important for online ...
In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s ...
MEMPHIS, Tenn.--(BUSINESS WIRE)--FedEx Corp. (NYSE: FDX) announced today that FedEx TechConnect has opened a new package laboratory to better serve customers. The 30,000+ square-foot facility will ...
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