Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but ...

One of the most expensive mistakes in product development is waiting to engage packaging engineering until after the product ...

The emphasis on heterogeneity is increasing the burden on OSATs and foundries to make sure everything works as expected inside a package. Putting a variety of chips or hardened IP blocks into a ...

“Rapid Fire with Medical Packaging Trailblazers” on June 15 during Virtual Engineering Days will cover several pressing issues in medical device packaging. Rod Patch, senior director, package ...

Dublin, July 10, 2024 (GLOBE NEWSWIRE) -- The "Cell Therapy Packaging Market: Industry Trends and Global Forecasts, till 2035 - Distribution by Type of Therapy Packed, Package Engineering Design, ...