Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

- Technical innovation cuts production cycle time by up to six months- First 3D-printed solar arrays will fly Spectrolab solar cells aboard small satellites built by Millennium Space Systems- Designed ...

Clorox has patented a method for creating multi-layer substrates using a thermoplastic material that allows for the passage of cleaning compositions between layers. The process involves bonding the ...