Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor ...

Along with emerging metaverse concepts, there is growing demand for equipment for package IC and HPC (high-performance computing) chips, as well as bonding mini/microLED chips, according to executive ...

Dublin, April 15, 2024 (GLOBE NEWSWIRE) -- The "Global Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die ...

2.5D IC packaging technology is expected to account for the largest share of the 3D IC and 2.5D IC packaging market during the forecast period. A 2.5D silicon interposer is a silicon or glass ...

The IC packaging market is projected to see steady growth this year, amid ongoing changes in the landscape. The outsourced semiconductor assembly and test (OSAT) industry, which provides third-party ...

(MENAFN- Asia Times) Advanced IC packaging is a hot new source of competition among manufacturers of AI processors and other advanced integrated circuits (ICs), and emerging as the next front in the ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

As highlighted by Towards Packaging research, the global packaging machinery market, valued at USD 53.26 billion in 2025, is ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.