The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...
A packaging process developed by Amkor Technology of Chandler, Ariz., is being described by the company as the packaging equivalent of a semiconductor move from 200- to 300-mm wafers. The company's ...
Another common challenge is the time required for verification signoff prior to manufacture. The proven way to avoid this bottleneck and its related impacts is to implement a process and methodology ...
Siemens’ industry-leading Calibre® nmPlatform tool is now certified for the latest Intel 18A production Process Design Kit (PDK). Intel 18A represents a significant technological leap forward, ...
Packaging advances are driving innovation at KLA-Tencor, which in May announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830. Designed for ...
For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.
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