SK Hynix recently announced a major investment in a new South Korean plant. The Icheon-based company will spend $12.9 billion to develop a facility dedicated to advanced ...
SK Hynix, Samsung, TSMC, and Micron are investing billions to meet demand for high-bandwidth memory and advanced chips for ...
SK Hynix Inc. is preparing a major capacity push as the global race to build AI-ready data centres strains the memory supply chain. The South Korean chipmaker plans to invest 19 trillion won ($12.9 ...
SK Hynix Inc, a key supplier to Nvidia and one of the worlds largest memory chipmakers, announced plans to invest 19 trillion ...
Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore. The new HBM advanced packaging facility will be the first ...
SK Hynix has announced this week it will invest 19 trillion won (or $12.90 billion) into a new advanced chip packaging ...
The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...
Micron Technology, Inc. has commenced the construction of a High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, the first of its kind in the country. The groundbreaking ceremony ...
The US government has imposed fresh export controls on the sale of high tech memory chips used in artificial intelligence (AI) applications to China. The rules apply to US-made high bandwidth memory ...
TL;DR: SK hynix is developing High Bandwidth Storage (HBS), combining mobile DRAM and NAND in a single package using innovative Vertical Wire Fan-Out (VFO) technology. This multi-layer stacked memory ...
Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging. Testing is ...
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