Intel has revealed more details today about its "breakthrough" glass substrate technology - a new way to manufacture processors that promises numerous benefits to todays standard organic substrate ...

AI workloads are pushing chips to their physical limits. Glass substrates and silicon photonics promise higher interconnect ...

Semiconductor substrate warpage and signal loss now have a Korean challenger to glass: Viacore and Aqlaser’s low-CTE ...

A specialized glass layer could make tomorrow’s computers faster and more energy efficient. Human-made glass is thousands of years old. But it’s now poised to find its way into the AI chips used in ...

Chiplets and advanced packaging have been on the cutting-edge of electronic technology for a while, but Intel is changing where it might be headed. Today’s organic substrates, like Ajinomoto build-up ...

These days when we talk about what's next for chip design, we focus on things like cramming in more cores, increasing clock speeds, shrinking transistors and 3D stacking. We rarely think about the ...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

Corning Incorporated GLW is focusing on expanding its portfolio of durable cover materials to gain a competitive advantage against rivals. The Corning Gorilla Glass Ceramic boasts an advanced ...