Used to protect LCD interfaces from destructive electromagnetic fields and electrostatic discharges, the LX7207 flip-chip array can eliminate up to 50 discrete components. The 5 x 5 array can support ...
Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...
A technical paper titled “A 112-Gb/s —8.2-dBm Sensitivity 4-PAM Linear TIA in 16-nm CMOS With Co-Packaged Photodiodes” was published by researchers at University of Toronto, Alphawave IP, and Huawei ...
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