TSMC is planning to adopt double patterning extensively at 20nm, despite the high cost of doing so. Why? Because EUV hasn't come through. Share on Facebook (opens in a new window) Share on X (opens in ...

SAN FRANCISCO — Amid probable delays for extreme ultraviolet (EUV) lithography, ASML, Canon and Nikon are updating their roadmaps, racing each other to capitalize on the shift towards ...

Researchers, equipment vendors, and manufacturers alike are watching with growing concern as we creep every closer to the end of 193 nm optical lithography. The problem is not that there are no ...

Startup Substrate is building next-generation semiconductor fabs using advanced X-ray lithography. This goes beyond extreme ...