SAN JOSE, Calif. — For next-generation memory production, 193-nm lithography with self-aligned double-patterning (SADP) are the technology of choices over rival schemes, according to an analyst.

During the Sematech Litho Forum held last week in Bolton Landing, NY, semiconductor manufacturers, equipment suppliers and researchers gathered to evaluate the progress of the various technology ...

TSMC is planning to adopt double patterning extensively at 20nm, despite the high cost of doing so. Why? Because EUV hasn't come through. Share on Facebook (opens in a new window) Share on X (opens in ...

Share and share alike! Our mothers always said it was the right thing to do, and it seems that this ideology is now coming front and center for double patterning at 20nm and below. As we continue to ...

As the optical lithography advances into the sub-30nm technology node, the various candidates of lithography have been discussed. Double dipole lithography (DDL) has been a primary lithography ...