Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause ...
YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...
AMD has been featured considerably in new leaks from Moore's Law is Dead, with Tom providing some more details on AMD's next-gen Instinct MI300 accelerator. The new AMD Instinct MI300 accelerator will ...
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Intel Foundry Roadmap Update - New 18A-PT variant that enables 3D die stacking, 14A process node enablement
Intel's new CEO Lip Bu-Tan took to the stage at the company's Intel Foundry Direct 2025 event here in San Jose, California, to outline the company's progress on its foundry initiative. Tan announced ...
A technical paper titled “Multi-tier Die Stacking Through Collective Die-to-Wafer Hybrid bonding” was published by researchers at imec, Brewer Science and SUSS MicroTec Lithography GmbH. “A collective ...
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