Designers can use resistive IC-based thin-film microheating elements to manufacture relatively low-cost integrated MEMS accelerometers in a standard CMOS process. This novel method, developed by the ...
NORTH ANDOVER, Mass. — Memsic Inc., a developer of MEMS-based accelerometers and sensors in CMOS process technology spun out from Analog Devices Inc. in 1999, has occupied and qualified a second ...
KYOTO, Japan—Micro-electro-mechanical systems (MEMS) vendor Invensense Inc. Tuesday (Nov. 9) introduced the world's first integrated MEMS to include both a gyroscope and accelerometer on a single CMOS ...
Memsmart Semiconductor, a Taiwan-based fabless IC design company, has begun mass production of CMOS-MEMS accelerometers (g-sensors), according to company president Eason Chiu. The company is initially ...
Memsmart Semiconductor, a fabless IC design company, is planning to mass produce the first CMOS-MEMS accelerometers by the end of 2008. Since the CMOS process has the advantage of lower production ...
SHANGHAI, Jan. 5, 2015 -- MEMSensing Microsystems Co., Ltd. ("MEMSensing"), a pioneer in MEMS sensor design and products development in China, and Semiconductor Manufacturing International Corporation ...
The MXC6226XC MEMS is said to be the world’s smallest, fully integrated, two-axis digital accelerometer. It is made using a 0.18-μm CMOS process and advanced wafer- level packaging (WLP). The ...
HSINCHU, Taiwan, January, 19, 2011-- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that the company has produced customer ...
Freeing up space in portable designs, the LIS344AL logs in as a cost-sensitive MEMS-based accelerometer sporting an ultra-compact 4 mm x 4 mm x 1.5 mm footprint. Its plastic-package houses a robust ...
Micro-electromechanical systems (MEMS) are well known for enabling innovative capabilities for devices that range from vehicles and gaming to smartphones and tablets—and increasingly in personal ...
Baolab Microsystems has announced a new technology to construct nanoscale MEMS (Micro Electro Mechanical Systems) within the structure of the actual CMOS wafer itself using standard, high volume CMOS ...
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