The FTCO3V455A1 is a 40V low Rds(on) automotive qualified power module featuring a 3-phase MOSFET inverter optimizedfor 12V battery systems. It includes a precision shunt resistor for current sensing ...

The APM32 series modules enable faster charging and increased range for all types of electrical vehicles PHOENIX--(BUSINESS WIRE)-- onsemi (Nasdaq: ON), a leader in intelligent power and sensing ...

ON Semiconductor has released the first two devices from its new VE-New LinkTrac family of power modules for high-voltage automotive traction inverters. These two power integrated modules (PIMs) ...

Infineon Technologies AG launches its new EconoDUALT 3 IGBT modules, which are fully qualified according to automotive standards. Infineon Technologies AG launches its new EconoDUALT 3 IGBT modules, ...

The market is poised for growth driven by increased EV demand, AI-enhanced motor control, renewable energy expansion, and SiC technology Intelligent Power Module Market Intelligent Power Module Market ...

PHOENIX--(BUSINESS WIRE)--ON Semiconductor (Nasdaq: ON), driving energy efficiency innovations, has further expanded its portfolio of automotive Power Integrated Modules (PIMs) with the introduction ...

The global market for power semiconductors used in cars and light passenger vehicles is expected to grow by more than $3 billion in the next six years. The global market for power semiconductors used ...

With the global car market showing signs of recovery, power module leadframe maker Jih Lin Technology is confident about a 10-20% on-year revenue growth in 2021 with leadframes for automotive power ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Automotive engineers are constantly looking for ways to reduce fuel consumption and lower CO 2 emissions, while at the same time lowering overall system costs. To ...

The automotive industry has experienced significant changes in recent years due to electrification and the growing demand for enhanced safety, comfort, and luxury features. In today’s high-end ...

Taiwan leadframe makers are likely to raise quotes for leadframes for packaging automotive chips and power modules by 5-10% to reflect increased material costs amid increasing demand from ...