As global chipmaking leaders like Intel are optimistic about introducing glass substrates for advanced IC packaging, Japan-based PCB suppliers are capitalizing on the emerging technology. Save my User ...
Innovative IC substrate manufacturer Phoenix Pioneer Technology is undergoing a strategic transformation into advanced packaging. The company is developing cutting-edge xQFN lead frames and fan-out ...
BANGALORE, India, Dec. 17, 2025 /PRNewswire/ --Semiconductor Advanced Substrate Market Size The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is ...
Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...
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